PVA Brush System

A Revolution in Wafer Cleaning Technology

The first PVA brush design innovation in over 20 years

The TC-23™ PVA Brush System maximizes the efficiency of DI water and cleaning chemistries, revolutionizing the wafer cleaning process.

With the TC-23™, you'll witness a significant reduction in contaminating particles, translating to less break-in time, minimized wafer defects and significantly increased wafer production yields. The optimized fluid distribution delivers even cleaning performance and superior purging of contaminants.

The patent pending design of the TC-23™ reduces DI water and chemistries usage up to 47% , uses 70% less PVA than standard brushes resulting in less residual PVA particles and is crafted with non-toxic polypropylene for a greener more environmentally friendly approach to manufacturing.


Increased Yields

70% Less PVA

up to 47% Less di water and chemistries

Less Break In Time

Eco Friendly

TC-23 PVA Eco Brush System

Industry-Standard Brush

  • Less PVA
  • Low level of contaminants
  • Accelerated brush break-in
  • Fluids flows exclusively through nodule
  • Reduces DI and Chemistries usage
  • Minimized environmental footprint
  • Thick PVA Body
  • High level of contaminates
  • Long break-in
  • Undirected waterflow
  • High water usage
  • Significant environmental impact
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Download the TC-23™ Data Sheet for Comprehensive Information on Advanced Run-Out Tests, Nodule Surface Analysis, and More!

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Join the sample program for qualification samples of the TC-23™ PVA Brush System.

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